One technogic from China got to the HTC HD2 and disassembled it for parts.

The process of opening, something like iMac'i:



Remove the back cover:


PCB details:



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Radio module:

Open the lid, in the middle we see the System-On-Chip Qualcomm Snapdragon:

The culprit in full view:

The quality of the PCB and assembly is top notch. It seems that such things can not be cheap :)
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