Efficient cooling for the CPU is just
The problem of the ever-increasing heat generation by modern high-performance processors is forcing engineers to create increasingly sophisticated devices for cooling them. However, the existing and long familiar to ordinary metal radiators still have room to develop, according to the research division of IBM. An idea was born there that would allow simply and very cheaply to double the efficiency of heat transfer from a hot chip to a metal grille.
Everyone who has ever assembled a computer on their own knows for sure how important it is to apply thermal grease on the surface of the cooler correctly. If its layer is too thin - the processor can overheat, too thick - the same. It is difficult to control the thickness of the coating with micrometer accuracy not only in domestic conditions, but also at the factory.
The error here can cost degradation of thermal conductivity of the paste twice. This is caused by the occurrence of inhomogeneities in the distribution by volume of the coating of particles of a metal or ceramic that make up its working basis. As a rule, inhomogeneities form a cross, as in the figure below.
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To solve this problem, as it turned out, it can be quite a simple way. Microscopic thick grooves are applied on the processor lid facing the cooler. Moreover, when applying alternate furrows with different depths. Such a simple action can significantly improve the uniformity of applying the paste, reduce the pressure between the radiator and the processor (and therefore remove excess voltage from it) and, most importantly, take heat from the CPU much faster.
The necessary industrial equipment for improving the production of processors is already being developed and promises to be very cheap, so this innovation will not have a noticeable impact on the cost of ready-made processors.
via Ars Technica , photo by IBM
Everyone who has ever assembled a computer on their own knows for sure how important it is to apply thermal grease on the surface of the cooler correctly. If its layer is too thin - the processor can overheat, too thick - the same. It is difficult to control the thickness of the coating with micrometer accuracy not only in domestic conditions, but also at the factory.
The error here can cost degradation of thermal conductivity of the paste twice. This is caused by the occurrence of inhomogeneities in the distribution by volume of the coating of particles of a metal or ceramic that make up its working basis. As a rule, inhomogeneities form a cross, as in the figure below.
')
To solve this problem, as it turned out, it can be quite a simple way. Microscopic thick grooves are applied on the processor lid facing the cooler. Moreover, when applying alternate furrows with different depths. Such a simple action can significantly improve the uniformity of applying the paste, reduce the pressure between the radiator and the processor (and therefore remove excess voltage from it) and, most importantly, take heat from the CPU much faster.
The necessary industrial equipment for improving the production of processors is already being developed and promises to be very cheap, so this innovation will not have a noticeable impact on the cost of ready-made processors.
via Ars Technica , photo by IBM
Source: https://habr.com/ru/post/5812/
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