FMC mezzanine modules for building high-performance signal processing systems
One of the most notable problems faced by developers of embedded systems is the variety of technical requirements for the organization of an external I / O interface. Regardless of whether it is Ethernet with an optical or “copper” physical data transfer layer, an analog interface or a gigabit serial interface, system developers need a set of tools to effectively create the necessary combination of interfaces in a computing system.
FMC mezzanine module
One of the ways to solve this problem is to use a “two-component system” consisting of a carrier board with a processing unit and a mezzanine module, which serves to organize the input / output of signals.
This approach is well standardized and includes several form factors of mezzanine modules, such as PMC and XMC, and specialized carrier designs, the most common of which are VME, VPX, CompactPCI, AdvancedTCA, MicroTCA, PCI, PXI form factor modules. The interaction between the carrier card and the PMC and XMC mezzanine modules is based on PCI and PCI-Express buses, respectively.
')
The wide distribution of FPGA technology (Field-Programmable Gate Array) only confirmed the correctness of the approach dividing the components of the embedded computing system into I / O devices and mathematical processing devices and, evolutionary, led to the standardization of I / O modules. In 2008, the ANSI / VITA 57.1 FPGA Mezzanine Card (FMC) cross-platform standard was finalized. This standard defines the design of the module and the physical interface of the module with a carrier board (type of plug connector, a set of signals, their physical characteristics and location on the connector pins). The protocol of interaction of the module with the carrier board standard is not limited due to the variety of possible types of input / output interfaces. That is what makes the standard of FMC modules, in contrast to PMC, XMC, truly cross-platform and applicable on the basis of any carrier boards.
FMC mezzanine modules have a form factor with dimensions of single (69x76.5 mm) or double (139x76.5 mm) size. The modules are joined as mezzanines with special data processing carrier boards containing programmable logic integrated circuits (FPGAs). The standard defines two variants of the connector for the docking of the carrier and mezzanine FMC modules, namely, Low Pin Count (LPC) for 160 lines, or High Pin Count (HPC) for 400 lines (plug-type connectors are pin-compatible).
On the mezzanine FMC modules are input / output devices and primary signal processing, such as ADC, DAC, DDC, or interface transceivers. The elimination of intermediate interface bridges allows you to maximize data throughput. FMC technology allows you to significantly simplify the process of designing embedded systems.
Advantages of FMC modules:
Maximum bandwidth - individual data transfer rate up to 10 Gb / s, with a total bandwidth of up to 100 GB / s and more between mezzanine and FPGA.
The minimum latency is due to the exclusion of intermediate interface bridges, which also ensures the determinism of data delivery.
Reduced design complexity — I / O connects directly to the FPGA, so experience with standard protocols such as PCI, PCI Express, or Serial RapidIO is not required. The possibility of direct connection between the mezzanine chips and the FPGA of the carrier module is supported, including through multi-gigabit transceivers.
Minimum system costs. Simplifying system design reduces the cost of IP cores, reduces development time and reduces component costs for the finished product.
The scope of FMC mezzanine modules is extremely wide and includes communication systems, radiolocation, hydroacoustics, speech processing and recognition, laboratory equipment, industrial equipment automation systems, medical diagnostics systems, digital radio and television, etc.
FMC module manufacturers
Domestic: CJSC Scan Engineering Telecom, Instrumental Systems (CJSC InSys), Fastwel.
Foreign: Abaco, Aldec, Curtiss-Wright, Extreme Engineering Solutions (X-ES), Mercury Systems, Faster Technology, Hitech global.
FMC mezzanine module
One of the ways to solve this problem is to use a “two-component system” consisting of a carrier board with a processing unit and a mezzanine module, which serves to organize the input / output of signals.
This approach is well standardized and includes several form factors of mezzanine modules, such as PMC and XMC, and specialized carrier designs, the most common of which are VME, VPX, CompactPCI, AdvancedTCA, MicroTCA, PCI, PXI form factor modules. The interaction between the carrier card and the PMC and XMC mezzanine modules is based on PCI and PCI-Express buses, respectively.
')
The wide distribution of FPGA technology (Field-Programmable Gate Array) only confirmed the correctness of the approach dividing the components of the embedded computing system into I / O devices and mathematical processing devices and, evolutionary, led to the standardization of I / O modules. In 2008, the ANSI / VITA 57.1 FPGA Mezzanine Card (FMC) cross-platform standard was finalized. This standard defines the design of the module and the physical interface of the module with a carrier board (type of plug connector, a set of signals, their physical characteristics and location on the connector pins). The protocol of interaction of the module with the carrier board standard is not limited due to the variety of possible types of input / output interfaces. That is what makes the standard of FMC modules, in contrast to PMC, XMC, truly cross-platform and applicable on the basis of any carrier boards.
FMC mezzanine modules have a form factor with dimensions of single (69x76.5 mm) or double (139x76.5 mm) size. The modules are joined as mezzanines with special data processing carrier boards containing programmable logic integrated circuits (FPGAs). The standard defines two variants of the connector for the docking of the carrier and mezzanine FMC modules, namely, Low Pin Count (LPC) for 160 lines, or High Pin Count (HPC) for 400 lines (plug-type connectors are pin-compatible).
On the mezzanine FMC modules are input / output devices and primary signal processing, such as ADC, DAC, DDC, or interface transceivers. The elimination of intermediate interface bridges allows you to maximize data throughput. FMC technology allows you to significantly simplify the process of designing embedded systems.
Advantages of FMC modules:
Maximum bandwidth - individual data transfer rate up to 10 Gb / s, with a total bandwidth of up to 100 GB / s and more between mezzanine and FPGA.
The minimum latency is due to the exclusion of intermediate interface bridges, which also ensures the determinism of data delivery.
Reduced design complexity — I / O connects directly to the FPGA, so experience with standard protocols such as PCI, PCI Express, or Serial RapidIO is not required. The possibility of direct connection between the mezzanine chips and the FPGA of the carrier module is supported, including through multi-gigabit transceivers.
Minimum system costs. Simplifying system design reduces the cost of IP cores, reduces development time and reduces component costs for the finished product.
The scope of FMC mezzanine modules is extremely wide and includes communication systems, radiolocation, hydroacoustics, speech processing and recognition, laboratory equipment, industrial equipment automation systems, medical diagnostics systems, digital radio and television, etc.
FMC module manufacturers
Domestic: CJSC Scan Engineering Telecom, Instrumental Systems (CJSC InSys), Fastwel.
Foreign: Abaco, Aldec, Curtiss-Wright, Extreme Engineering Solutions (X-ES), Mercury Systems, Faster Technology, Hitech global.
Source: https://habr.com/ru/post/371021/
All Articles