Stuffing MacBook Air goes to the masses

Intel, which six months ago, at Jobs’s request, released an exclusive processor and chipset specifically for ultra-thin MacBook Air laptops, now intends to bring these developments to the mass market. A special version of the chipset and processors from the Centrino 2 set was created on the basis of the Apple chips. Apparently, under the agreement with Jobs, Intel could not start supplying this hardware earlier, but by the end of August the agreement will expire.

In the third week of August, Intel will officially unveil the Centrino 2 SFF, that is, the processor and chipset for small form factor notebooks (SFF). It will use exactly the same chip placement technology that was used in Core 2 Duo processors, custom-made by Apple for the MacBook Air.

No details have been disclosed yet, but it is known that several models of processors will be released in SFF format. So surely at the same time, a whole line of ultra-thin laptops from different manufacturers will rush to the market.
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via News.com