IBM injects water tubes right into the chips
Scientists from the IBM Zurich research laboratory and the Fraunhofer Institute proposed a conceptual model of the heat sink system for microchips. As can be seen in the illustration, microtubes with water (50 microns thick) are embedded right inside the chip between the silicon layers. Such a system will be required in future microchips, which will be created using three-dimensional technology from solid silicon, rather than layer-by-layer overlaying of plates, as it is now.
Microtubes are absolutely tight and packed in two layers: silicon and silicon oxide. To connect the segments of the tubes from different layers into a single unit, without damaging the silicon, the scientists used a mixture of gold and tin, such a solder has a low melting point.
The three-dimensional architecture of microchips will allow reducing information routes inside the chip by several orders of magnitude and, accordingly, increasing its performance. But these structures will emit much more heat, which is why they may require a much more powerful cooling system, with an ordinary air fan, you will not manage.
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According to experts, the chip with water cooling can appear on sale in 5-10 years. At first, such chips will be used in supercomputers, but then, obviously, they will appear in home PCs.
Generally speaking, water cooling of computers is an old technology, to which the second wind has now arrived. Such cooling was used in servers manufactured in the 60s and 70s of the last century, then they forgot about it, and now entire data centers are being tied up with water tubes . In April 2008, IBM released a water-cooled hydro cluster . On the problem of integrating microtubes with water into microchips, other than IBM, other groups of scientists are now working .
Microtubes are absolutely tight and packed in two layers: silicon and silicon oxide. To connect the segments of the tubes from different layers into a single unit, without damaging the silicon, the scientists used a mixture of gold and tin, such a solder has a low melting point.
The three-dimensional architecture of microchips will allow reducing information routes inside the chip by several orders of magnitude and, accordingly, increasing its performance. But these structures will emit much more heat, which is why they may require a much more powerful cooling system, with an ordinary air fan, you will not manage.
')
According to experts, the chip with water cooling can appear on sale in 5-10 years. At first, such chips will be used in supercomputers, but then, obviously, they will appear in home PCs.
Generally speaking, water cooling of computers is an old technology, to which the second wind has now arrived. Such cooling was used in servers manufactured in the 60s and 70s of the last century, then they forgot about it, and now entire data centers are being tied up with water tubes . In April 2008, IBM released a water-cooled hydro cluster . On the problem of integrating microtubes with water into microchips, other than IBM, other groups of scientists are now working .
Source: https://habr.com/ru/post/26950/
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