LEC-2126 Network Platform Overview

Today we will present to your attention an overview of the industrial thin client / network platform in the original performance of a fanless package. Meet Lanner LEC-2126 .

The first thing you immediately notice when you take it in hand is weight. With a small size of the device, 20 by 15 cm, it weighs more than 2 kilograms. The case, which is also a radiator, is made of thick steel, and its surface is covered with fins of heat sink.



The next interesting point is that to access the device’s motherboard, you don’t even need to have a screwdriver with you, the role of fixing the bottom cover is assigned to the four rubber feet-screws.
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The thickness of the walls of the case ~ 3-4mm. According to the manufacturer, the case is completely dustproof.



The platform has 6 Gigabit RJ45 interfaces on Intel controllers, a Mini-PCI-e slot with a SIM card reader for embedded modems, a CompactFlash card slot and a bunch of customization interfaces.



Standard package:



Detailed specifications:

• Dimensions of the device: 198 x 42 x 145mm.
• Chipset Intel ICH8M.
• Dual-core Intel Atom D510 1.66GHz CPU.
• Up to 2 GB DDR2 RAM SODIMM.
• 1x CompactFlash Type II socket; 1x HDD / SSD 2.5 ”bay.
• Passive cooling of the CPU.
• Intel GMA3150 graphics, DB15 VGA output (2048x1536 @ 75Hz).
• 1x Mini-PCIe with SIM card reader.
• Power Adapter 60W @ 12v 2a
• 6x GbE interfaces. Intel 82574L x1, Intel 82583V x5
• 1x Console RJ45 port; 2x USB 2.0
• Hardware monitor Winbond W82327THG
• Weight: 2.5 kg.
• Temperature condition: 0 ~ 40 C
• Certifications: CE emission, FCC Class A

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