USB 3.0 will be an optical interface
At the IDF forum currently underway, Intel senior vice president Pat Gelsinger spoke not only about new server flash drives, but also about much more interesting things. In particular, about the next generation of USB bus.
The creation of USB 3.0 technology, the development of which is currently in its infancy, is being developed by Intel in collaboration with Microsoft, Hewlett-Packard, Texas Instruments, NEC and NXP Semiconductors. According to Gelsinger, the USB 3.0 bus will be able to provide a 10-fold increase in speed compared to the current USB 2.0, and the peak bandwidth will reach 4.8 Gb / s. All this will be possible through the use of optical and copper connecting cables. It is important to note that this will ensure backward compatibility, so that the old hardware will work on the new bus without problems. However, with all the promised benefits, the developers, apparently, are not going to cope with one important problem - the relatively high CPU utilization.
The first version of the specification USB 3.0 developers plan to submit in the first half of next year, and the production of appropriate devices will begin in 2009 or 2010.
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via CNET News.com
The creation of USB 3.0 technology, the development of which is currently in its infancy, is being developed by Intel in collaboration with Microsoft, Hewlett-Packard, Texas Instruments, NEC and NXP Semiconductors. According to Gelsinger, the USB 3.0 bus will be able to provide a 10-fold increase in speed compared to the current USB 2.0, and the peak bandwidth will reach 4.8 Gb / s. All this will be possible through the use of optical and copper connecting cables. It is important to note that this will ensure backward compatibility, so that the old hardware will work on the new bus without problems. However, with all the promised benefits, the developers, apparently, are not going to cope with one important problem - the relatively high CPU utilization.
The first version of the specification USB 3.0 developers plan to submit in the first half of next year, and the production of appropriate devices will begin in 2009 or 2010.
')
via CNET News.com
Source: https://habr.com/ru/post/14244/
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