The thinnest substrate for semiconductor manufacturing

The Korean company Samsung recently announced the creation of a substrate for the production of semiconductors, the thickness of which is only 0.08 mm. This is 20% less than the 0.1 mm backing that Samsung released in 2005. The whole point is that thanks to such a small thickness, the new substrate will allow producing twenty-layer static and flash memory chips.

So far, Samsung has just started to provide the first test samples of a 0.08 mm substrate to interested companies. According to representatives of the company, Samsung plans to begin mass production by the end of 2007.

via Russan Mobile