Modification of Asus Eee PC 900 SSD and Huawei E150 USB 3G integration
Modification of the internal SSD.
Native SAMSUNG 807 K9F8G08U0M 1GB X 4 memory chips replaced with SAMSUNG 825 K9LBG08U0M 4GB X 2:
Donor "killed" EXPLAY T10 8GB MP3 player:
In the first bank at the landing site of the microcircuit during dismantling, 3 contact pads were broken. On the datasheet, these contacts are not involved. Good luck chased me for 3 hours.
And at 2 am the “hedgehog” was ready. All of the memory deletion with the parameters ERASEALL.EXE 368 M AP2M0J.bin and the firmware with the config is over:
[General Info]
VendorName = ShEll
ProductName = ASUS SSD
ModelName = 8GB SSD
[Flash info]
Flh_MakeCode = Samsung
Flh_DeviceCode = 4096
Flh_Capacity = 8192
Flh_Number = 2
[Card Info]
DeviceType = fixed
ISP_MPBINCode = AP2M1B.bin
IDEAddress = 0x170
IDEType = 0xA0
')
Tools used when working:
- soldering station LUKEY 852D +;
-blades;
-cancelite (flux-gel was not absent);
Hair mode:
- dismantling of chips with a temperature of 360 degrees with the thinnest nozzle;
-installation of chips with a temperature of 380 degrees with the thinnest nozzle;
ATTENTION!
Chips we warm strictly in places of contact platforms!
“Specific external conditions can drastically reduce the data retention period. For example, elevated temperatures or radioactive radiation. ”
Integration of 3G USB Modem Huawei E150.
Removed SIM socket, USB connector, external antenna connector:
Isolation of "bare spots" modem:
Found a place on the mother for the soldering of the SIM-reader and clipped the case under the SIM card:
Attempt to shove modem number 2. We tear off the right speaker, move it to the left closely to the other and put it on super-glue, breaking out the remaining supports. In the middle there is ventilation from where the sound from the transplanted speaker will be output. To the right remains a place clearly under the size of the E150 modem and the slot for cooling the device:
So it looks like everything assembled without a hedgehog case with a soldered antenna. Under the WI-FI module, the modem is soldered to an unused USB (information on unused USB in the ASUS Eee PC can be found on the network), the same is also available under the removable SSD disk:
An antenna from a donor was taken for tests - Motorola L6:
Signal level and SAR are normal:
The second option is already built-in antenna from the mobile phone FLY:
Other antenna options can be found on the net.
Native SAMSUNG 807 K9F8G08U0M 1GB X 4 memory chips replaced with SAMSUNG 825 K9LBG08U0M 4GB X 2:
Donor "killed" EXPLAY T10 8GB MP3 player:
In the first bank at the landing site of the microcircuit during dismantling, 3 contact pads were broken. On the datasheet, these contacts are not involved. Good luck chased me for 3 hours.
And at 2 am the “hedgehog” was ready. All of the memory deletion with the parameters ERASEALL.EXE 368 M AP2M0J.bin and the firmware with the config is over:
[General Info]
VendorName = ShEll
ProductName = ASUS SSD
ModelName = 8GB SSD
[Flash info]
Flh_MakeCode = Samsung
Flh_DeviceCode = 4096
Flh_Capacity = 8192
Flh_Number = 2
[Card Info]
DeviceType = fixed
ISP_MPBINCode = AP2M1B.bin
IDEAddress = 0x170
IDEType = 0xA0
')
Tools used when working:
- soldering station LUKEY 852D +;
-blades;
-cancelite (flux-gel was not absent);
Hair mode:
- dismantling of chips with a temperature of 360 degrees with the thinnest nozzle;
-installation of chips with a temperature of 380 degrees with the thinnest nozzle;
ATTENTION!
Chips we warm strictly in places of contact platforms!
“Specific external conditions can drastically reduce the data retention period. For example, elevated temperatures or radioactive radiation. ”
Integration of 3G USB Modem Huawei E150.
Removed SIM socket, USB connector, external antenna connector:
Isolation of "bare spots" modem:
Found a place on the mother for the soldering of the SIM-reader and clipped the case under the SIM card:
Attempt to shove modem number 2. We tear off the right speaker, move it to the left closely to the other and put it on super-glue, breaking out the remaining supports. In the middle there is ventilation from where the sound from the transplanted speaker will be output. To the right remains a place clearly under the size of the E150 modem and the slot for cooling the device:
So it looks like everything assembled without a hedgehog case with a soldered antenna. Under the WI-FI module, the modem is soldered to an unused USB (information on unused USB in the ASUS Eee PC can be found on the network), the same is also available under the removable SSD disk:
An antenna from a donor was taken for tests - Motorola L6:
Signal level and SAR are normal:
The second option is already built-in antenna from the mobile phone FLY:
Other antenna options can be found on the net.
Source: https://habr.com/ru/post/137669/
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