Repair AMD Athlon processor
Yes, yes, you heard right! It is repair! But first things first.
Some time ago, I began to hang and cut down the computer. Symptoms were very similar to overheating, except for one thing - the temperature sensor did not rise above 72-74 degrees. This is also not small, although it is clearly not enough for everything to be cut down. Maybe the sensor is lying?
I climb under the table, remove the cover from the system unit. There is almost no dust in the cooler - blowing is not enough.
')
We feel the cooler - cold, 40 degrees from strength. Maybe peeled off? Why would? .. We glue, replacing the thermal grease. The effect is zero. The sensor still shows 70, and the cooler is as cold as a corpse! There is something to think about ...
Googling the forums find out that the problem may be in the thermal paste inside the stone, between the crystal and the body. Well ... Armed with a sharp knife, thermopaste, glue and "straight hands" proceed to the autopsy.
The outer metal casing is glued to the board around the perimeter. Carefully cut it, immersing the knife by 2-3 mm.
OK. Housing shot. Please note that the body was not fully sealed - there is a small gap in the glue. This will be important when gluing.
Now carefully consider the thermal grease. She became hard, almost lost elasticity. In addition, there are clear signs of a bubble in the middle of the crystal. Apparently, this was the problem.
Change the thermal grease. Apply glue around the perimeter of the case, not forgetting to leave a small non-glued gap, as it was in the original, and seal the case.
Voila The processor has been restored and is working properly.
PS: More than a month has passed since the operation. So far so good.
UPD1: Cyanoacrylate was used as a glue, but I'm not sure that it was a good idea.
UPD2:
Why is not glued area.
Under the casing there is air, which, of course, expands when heated. Where glue is applied, the casing is fitted tightly. In the same place where there is no glue, the cover of the casing against the PCB is not so dense, not tight. Thus, the unglued area is needed so that when the temperature rises, the processor does not inflate like a balloon.
Some time ago, I began to hang and cut down the computer. Symptoms were very similar to overheating, except for one thing - the temperature sensor did not rise above 72-74 degrees. This is also not small, although it is clearly not enough for everything to be cut down. Maybe the sensor is lying?
I climb under the table, remove the cover from the system unit. There is almost no dust in the cooler - blowing is not enough.
')
We feel the cooler - cold, 40 degrees from strength. Maybe peeled off? Why would? .. We glue, replacing the thermal grease. The effect is zero. The sensor still shows 70, and the cooler is as cold as a corpse! There is something to think about ...
Googling the forums find out that the problem may be in the thermal paste inside the stone, between the crystal and the body. Well ... Armed with a sharp knife, thermopaste, glue and "straight hands" proceed to the autopsy.
The outer metal casing is glued to the board around the perimeter. Carefully cut it, immersing the knife by 2-3 mm.
OK. Housing shot. Please note that the body was not fully sealed - there is a small gap in the glue. This will be important when gluing.
Now carefully consider the thermal grease. She became hard, almost lost elasticity. In addition, there are clear signs of a bubble in the middle of the crystal. Apparently, this was the problem.
Change the thermal grease. Apply glue around the perimeter of the case, not forgetting to leave a small non-glued gap, as it was in the original, and seal the case.
Voila The processor has been restored and is working properly.
PS: More than a month has passed since the operation. So far so good.
UPD1: Cyanoacrylate was used as a glue, but I'm not sure that it was a good idea.
UPD2:
Why is not glued area.
Under the casing there is air, which, of course, expands when heated. Where glue is applied, the casing is fitted tightly. In the same place where there is no glue, the cover of the casing against the PCB is not so dense, not tight. Thus, the unglued area is needed so that when the temperature rises, the processor does not inflate like a balloon.
Source: https://habr.com/ru/post/127957/
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